Inferra AI / Term research / CoWoS
CoWoS
TSMC's advanced packaging technology that bonds logic dies and HBM stacks on one interposer. It has been a binding bottleneck for AI accelerator supply.
Watch for: CoWoS capacity expansion mentions in TSM materials and any shift to alternative packaging by NVDA/AVGO.
“CoWoS” is used by 6 companies in 20 documents in this edition.
Documents using the term, by quarter
| Quarter | Documents |
|---|---|
| Q1 2026 | 3 |
| Q2 2026 | 2 |
| Q3 2026 | 0 |
| Q4 2026 (in progress) | 1 |
Q4 2026 is in progress — documents filed through Nov 1, 2026. Quarters are calendar quarters, bucketed by document date.
Companies using it most · documents · in Q4 2026
| # | Ticker | Company | Documents | In Q4 2026 |
|---|---|---|---|---|
| 1 | CRDO | Credo Technology | 9 | 0 in Q4 2026 |
| 2 | CAMT | Camtek Ltd | 3 | 1 in Q4 2026 |
| 3 | MRVL | Marvell Technology | 3 | 0 in Q4 2026 |
| 4 | NVDA | NVIDIA | 3 | 0 in Q4 2026 |
| 5 | ASX | ASE Technology Holding | 1 | 0 in Q4 2026 |
| 6 | TSM | Taiwan Semiconductor | 1 | 0 in Q4 2026 |
Evidence — the top-ranked company
Evidence
Credo Technology (CRDO)
9 documents use “CoWoS” in this edition — 0 in Q4 2026.
Earnings presentation
Credo Technology has no earnings presentation in this edition. Checked 2026-10-26 for the Quantum & Silicon Photonics rail: Credo publishes no earnings presentation at all — its quarterly reporting is an earnings release and webcast only; no deck appears on its investor-relations site and none has been furnished as an SEC exhibit. Substituted on the rail by CIEN (photonics bench).
Where the term appears — the documents
Credo Technology — 10-Q Quarterly report
IN THE FULL TEXT · “… chiplet included 64 lanes of 50Gbps SerDes and was built in 28nm using Chip-on-Wafer-on-Substrate (CoWoS) packaging technology from TSMC. • In 2018, we created AECs, a new category of data center system products,…”
Credo Technology — 10-Q Quarterly report
IN THE FULL TEXT · “… chiplet included 64 lanes of 50Gbps SerDes and was built in 28nm using Chip-on-Wafer-on-Substrate (CoWoS) packaging technology from TSMC. • In 2018, we created AECs, a new category of data center system products,…”
Credo Technology — 10-Q Quarterly report
IN THE FULL TEXT · “… chiplet included 64 lanes of 50Gbps SerDes and was built in 28nm using Chip-on-Wafer-on-Substrate (CoWoS) packaging technology from TSMC. • In 2018, we created AECs, a new category of data center system products,…”
Credo Technology — 10-K Annual report
IN THE FULL TEXT · “… chiplet included 64 lanes of 50Gbps SerDes and was built in 28nm using Chip-on-Wafer-on-Substrate (CoWoS) packaging technology from TSMC. • In 2018, we created AECs, a new category of datacenter system products,…”
Credo Technology — 10-Q Quarterly report
IN THE FULL TEXT · “… chiplet included 64 lanes of 50Gbps SerDes and was built in 28nm using Chip-on-Wafer-on-Substrate (CoWoS) packaging technology from TSMC. • In 2018, we created AECs, a new category of data center system products,…”
Credo Technology — 10-Q Quarterly report
IN THE FULL TEXT · “… chiplet included 64 lanes of 50Gbps SerDes and was built in 28nm using Chip-on-Wafer-on-Substrate (CoWoS) packaging technology from TSMC. • In 2018, we created AECs, a new category of data center system products,…”
Credo Technology — 10-Q Quarterly report
IN THE FULL TEXT · “… chiplet included 64 lanes of 50Gbps SerDes and was built in 28nm using Chip-on-Wafer-on-Substrate (CoWoS) packaging technology from TSMC. • In 2018, we created AECs, a new category of data center system products,…”
Credo Technology — 10-K Annual report
IN THE FULL TEXT · “… chiplet included 64 lanes of 50Gbps SerDes and was built in 28nm using Chip-on-Wafer-on-Substrate (CoWoS) packaging technology from TSMC. • In 2018, we created AECs, a new category of datacenter system products,…”
Credo Technology — 10-Q Quarterly report
IN THE FULL TEXT · “… chiplet included 64 lanes of 50Gbps SerDes and was built in 28nm using Chip-on-Wafer-on-Substrate (CoWoS) packaging technology from TSMC. • In 2018, we created AECs, a new category of datacenter system products,…”
Counts are documents containing the term, counted from this edition’s full-text index of the filings, the release and deck text the library holds, and document titles and details — the same sources the library search on the homepage runs on, so the two always agree. A document counts once, however many times the term appears in it.